High Thermal Conductivity / High Gloss Resist PCB
Features
- Without making big change in circuit design and specification, high heat dissipation effect can be realized
- Same L/T as normal rigid PWB
- No need to assemble additional reflection boards
- High tracking resistance to avoid electric fire occurrence (CTI value: 600V+)
Product Pictures
[High gloss resist PWB with other colors than white]
(From left, high gloss transparent green, non-transparent gloss grey, transparent gloss red, transparent gloss blue, matte black)
Product Properties
| Item | Test Conditions | Results |
|---|---|---|
| Solder Heat Resistance | Pretreatment (40 [°C] / 90 [%] / 96 [Hr]) : Solder floating method (260+5-0 [°C] / 120 [sec]) |
No floating of Cu, delamination or inflation |
| Withstand Voltage | Applied voltage (100/500 [V] / 1 [min]) : Between circuits (0.1[mm]) and between layers |
No mechanical damage, no spark over |
| Insulation | Applied voltage (100/500 [V] / 1 [min]) : Between circuits (0.1[mm]) and between layers |
More than 1 [GΩ] |
| Migration Resistance | Pretreatment (85 [°C] / 85 [%] / DC 50 [V] / 1000 [Hr]) : Insulation resistance measurement, visual inspection |
More than 1 [GΩ] No dendrite occurrence |
| Moisture Resistance | Test condition (40 [°C] / 90 [%] / DC 100 [V] / 96 [Hr]) : Insulation resistance measurement |
More than 1 [GΩ] |
| Thermal Shock Test | 260+5/0 [°C] / 10 [sec] : 20±5 [°C] / 20 [sec], 50 [Cycle] : Insulation resistance measurement |
Rate of change less than 10[%] |
Above numbers are actual measurements as a reference, not assurance of quality.