Flat Plug PCB (Permanent Hole-filling PCB)

Features

  • With screen printing method, selected through holes are filled with resin and protect the through holes.
  • With special polishing, it does not affect surface mounting.
  • UL acquired : Only for multi-layer PWB (4 or 6 layers) (Contact us for further inquiry)

Product Pictures

Picture after solder resist painted

Product Specifications

Cross Section
Item Symbol Standard Spec Note
Base Material - FR-4( R-1766 ) UL compatible: 4 or 6 layers and CEM-3
Thickness t 0.80 – 1.60 [mm]  
Resin Filled Diameter
(Final Diameter)		 A φ0.20 – 0.50 [mm]  
Resin Filled VIA min. distance B More than 0.55 [mm]  
Resin Filled VIA diameter difference A-C Less than 0.20 [mm] When there are more than two different diameters for resin fill
Aspect Ratio - Less than 8.0 t/A
Distance between filled VIA and through hole D More than 0.425 [mm]  
Surface treatment - OSP Sn, Pb or Pb-free solder level, gold plating compatible

Product Properties

Item Test Condition / Judge Standard Results
Cooling/heating cycle test result -65 °C / 30 min : 125 °C / 30 min : 100 After 100 cycles 1. Change rate of conductor resistivity: Ave. 1.18%
2. No problem
1. Change rate of conductor resistivity less than 10%
2. No change on appearance, no crack, no problem with adhesion
Solder heat resistance test result 40 °C / 90 %Rh / 96 Hr
: After 2 cycles of dipping into Pb-free solder 260°C / 20sec		 1. Change rate of conductor resistivity: Ave. 1.23%
2. No problem
1. Change rate of conductor resistivity less than 10%
2. No change on appearance, no crack, no problem with adhesion
Chemical resistance test result Soak into soft etching solution
(sulfuric acid - hydrogen peroxide) for 180 seconds
: 40 °C / 93 %Rh / 240 Hr 		1. Change rate of conductor resistivity: Ave. 0.09%
2. No problem
1. Change rate of conductor resistivity less than 10%
2. No change on appearance, no crack, no problem with adhesion

Above numbers are actual measurements as a reference, not assurance of quality.